![]() ![]() The typical low-Dk laminate material that should be familiar to every designer is PTFE. For applications in high-speed, these laminates are desirable as they can be used with most high-speed protocols (DDR3+, PCIe, gigabit Ethernet, MIPI standards, etc.). The glass weave styles in these laminates can vary greatly, from open (106) weaves to highly closed (2116) weaves and mechanical spread glass. Copper options: Typically ED or RA copper.Tg value: Low (~130 ☌) and high (~180 ☌) options available.These materials are used in a PCB stackup just like any other FR4-grade laminate would be used the materials are available in prepreg and core options, and there are no major hybrid construction issues to consider. Two of the most popular vendors for these materials are Isola and ITEQ, although there are others that produce comparable laminates. These materials are engineering epoxy-resin composite materials that are comparable in most ways to other FR4 laminates in terms of the primary material properties and constructions (glass weave/resin content, Tg value, mechanical properties). For now, let’s look at each of these material options: Low-loss FR4 ![]() I’ll discuss some of the typical times to use low-Dk materials below. This is one reason why they are often recommended for use in high-speed PCBs, but this recommendation is often provided without the correct context. These materials tend to have lower loss tangent than standard FR4-grade materials with higher Dk (ranging from ~4.2 to ~4.8). Plastic or PTFE-based bonding sheet materials PTFE-based materials (reinforced or unreinforced)
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |